모바일 디스플레이용 유리 기판의 미 식각부 두께 최소화를 위한 습식식각 공정조건 최적화 The Wet-etching Process Condition Optimization for Non-etching Section Thickness Minimization of the Glass Substrates for the Mobile Display

유승기, 김재경, 전의식

언어KOR
URLhttp://db.koreascholar.com/Article/Detail/298874

한국기계기술학회지 (韓國機械技術學會誌)

제17권 제2호 (2015.04)
pp.399-404

한국기계기술학회 (Korean Society of Mechanical Technology)

초록

The expansion of the display market could mass-produce the product which becomes the super-slim and ultra-lighting according to the demand of customer. This change etched the mobile display panel in order to make the thin glass. The wet etching refers to the process of removing selectively the unnecessary part in order to form the circuit pattern among the semi-conductor or the LCD manufacturing process. The wet etching can progress the etching about a large amount at a time but the thickness of glass is not smooth or not etched according to the process condition. In this study, the defect factor in the etching process tries to be analyze. The experimental design was established and the processing condition was optimized in order to minimize under non-etch part generation by the experiment of design.

키워드

Wet etching 습식 식각 공정 Process Glass 유리 Taguchi method 다구치 기법 실험계획법 Design of Experiments

1. 서 론
2. 습식 식각 및 공정파라미터
  2.1 글라스 면취
  2.2 식각률(Etching rate)
  2.3 유량
3. 실험 및 고찰
  3.1 다구치 방법
  3.2 실험 결과 및 분석
  3.3 회귀분석
4. 결 론
후 기
References

저자

유승기(Member, Kongju National University) | Seung- gi Yu
김재경(Kongju National University graduate school Department of mechanical engineering) | Jae-kyung K im
전의식(Member, Kongju National University) | Euy- sik Jeon Corresponding author

KOREASCHOLAR

모바일 디스플레이용 유리 기판의 미 식각부 두께 최소화를 위한 습식식각 공정조건 최적화 The Wet-etching Process Condition Optimization for Non-etching Section Thickness Minimization of the Glass Substrates for the Mobile Display