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함정탑재용 고발열 전자장비의 열적안정성 확보를 위한 수치적, 실험적 연구 Numerical Analysis and Experimental Study to Required Thermal Stability of High Heat Electronic Equipment for Shipboard Application

이재훈, 정의봉, 이건민, 윤창열, 이규송
  • 언어KOR
  • URLhttp://db.koreascholar.com/Article/Detail/421585
한국기계기술학회지 (韓國機械技術學會誌)
제25권 제2호 (2023.04)
pp.235-240
한국기계기술학회 (Korean Society of Mechanical Technology)
초록

In this study, we performed thermal safety design of the electric module of a heat-loaded equipment with consideration of its heat dissipation performance. Initially, we calculated the heat dissipation of natural convection to choose a cooling method. Based on this, we found that some modules required forced convection and selected an air-cooling method with an outdoor temperature of 43 degrees Celsius, which is the maximum temperature in Korea. Prior to module production, we performed thermal analysis of each module and proceeded with a design to increase the thermal conductivity of the module as a primary step, and subsequently proceeded with Heat Sink design to maximize the heat dissipation performance. After considering various constraints according to the system requirements and designing the cooling path, we experimentally and analytically secured thermal safety at the operating temperature of the equipment.

저자
  • 이재훈(LIG Nex1 C4ISTAR 기계융합연구소) | Jae-Hoon Lee
  • 정의봉(LIG넥스원) | Eui-Bong Jeong
  • 이건민(LIG넥스원) | Keon-Min Lee
  • 윤창열(국방과학연구소)
  • 이규송(국방과학연구소) | Kyu-Song Lee