Noncontact direct-printed conductive silver patterns with an enhanced electrical resistivity are fabricated using a silver ink with a mixture of silver nanoparticles and nanoplates. The microstructure and electrical resistivity of the silver pattern are systematically investigated as a function of the mixing ratio of the nanoparticles and nanoplates. The pattern, which is fabricated using a mixture with a mixing ratio of 3(nanoparticles):7(nanoplates) and sintered at 200oC shows a highly dense and well-sintered microstructure and has a resistivity of 7.60 μΩ·cm. This originates a mutual synergistic effect through a combination of the sinterability of the nanoparticles and the packing ability of the nanoplates. This is a conductive material that can be used to fabricate noncontact direct-printed conductive patterns with excellent electrical conductivity for various flexible electronics applications, including solar cells, displays, RFIDs, and sensors.

Abstract
 1. 서 론
 2. 실험방법
 3. 결과 및 고찰
 4. 결 론
 References

• 구용성(한양대학교 융합화학공학과) | Yong-Sung Goo (Department of Fusion Chemical Engineering, Hanyang University)
• 좌용호(한양대학교 융합화학공학과) | Yong-Ho Choa (Department of Fusion Chemical Engineering, Hanyang University)
• 황보영(서울과학기술대학교 신소재공학과) | Young Hwangbo (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
• 이영인(서울과학기술대학교 신소재공학과) | Young-In Lee (Department of Materials Science and Engineering, Seoul National University of Science and Technology) Corresponding Author