There has been a huge progress in semiconductor manufacturing processes such as reduction of the design rule(DR) and development of multi-processes. And, semiconductor industries have steadily extended its business and market share by reducing the design rule(DR) and enlarging the wafer size as well as by resolving many difficult technical problems through various noble approaches in order to reduce the production cost and to improve the yield. In semiconductor manufacturing, there is a significant difference in the number of memory chips produced according to the wafer size, wafer yield, and the level of the design rule even though the same number of wafers were put to the manufacturing process. So, almost all semiconductor manufacturing companies reach the conclusion that the enlarged size of wafer should be adopted in order to enhance the productivity and reduce the production cost. Thus, in this study, we investigate the specifications of the key functions and capabilities of the necessary modules in the yield analysis and improvement system required to acquire the stationary wafer yield with considering the 450mm wafer manufacturing system. Then the results of this research will be helpful for constructing the advanced yield analysis and improvement system called Real-Time Fault Monitoring and Detection (RTFMD) system.

1. 서 론
 2. 반도체 수율관리 및 개선 기법
 3. 450mm 웨이퍼 생산 환경에서의수율관리 시스템의 구현 방안
 4. 결론
 참 고 문 헌

• 박유진(중앙대학교 사회과학대학 상경학부 경영학과)
• 이현(한양대학교 공학대학 산업경영공학과)