This article reported a simple method for preparing diamond/SiC composites by polymer impregnation and pyrolysis (PIP) process, and the advantages of this method were discussed. Only diamond and SiC were contained in the diamond/SiC composite prepared by PIP process, and the diamond particles remained thermally stable up until the pyrolysis temperature was increased to 1600 °C. The pyrolysis temperature has a significant impact on the thermal conductivity and dielectric properties of composites. The thermal conductivity of the composite reaches a maximum value of 63.9 W/mK when the pyrolysis temperature is 1600 °C, and the minimum values of the real and imaginary part of the complex permittivity are 19.5 and 0.77, respectively. The PIP process is a quick and easy method to prepare diamond/SiC composites without needing expensive equipment, and it is of importance for promoting its application in the field of electric packaging substrate.

    Abstract
    1 Introduction
    2 Experiment procedure
        2.1 Raw materials
        2.2 Preparation of samples
        2.3 Characterization methods
    3 Result and discussion
    4 Conclusion
    Acknowledgements 
    References

• Pengfei Liu(Institute for Advanced Material and Technology, University of Science and Technology Beijing)
• Xinbo He(Institute for Advanced Material and Technology, University of Science and Technology Beijing, Guangzhou Institute of Advanced Materials, University of Science and Technology Beijing)
• Xuanhui Qu(Institute for Advanced Material and Technology, University of Science and Technology Beijing)