Atomic layer deposition (ALD) is widely used as a tool for the formation of near-atomically flat and uniform thin films in the semiconductor and display industries because of its excellent uniformity. Nowadays, ALD is being extensively used in diverse fields, such as energy and biology. By controlling the reactivity of the surface, either homogeneous or inhomogeneous coating on the shell of nanostructured powder can be accomplished by the ALD process. However, the ALD process on the powder largely depends on the displacement of powder in the reactor. Therefore, the technology for the fluidization of the powder is very important to redistribute its position during the ALD process. Herein, an overview of the three types of ALD reactors to agitate or fluidize the powder to improve the conformality of coating is presented. The principle of fluidization its advantages, examples, and limitations are addressed.

Abstract
 서 론
 분말용 ALD 코팅 기술 개요
 분말용 ALD 리액터 방식 고안
  3.1 가스 유동화 방법
  3.2 기계적 유동화 방법
  3.3 회전식 유동화 방법
 4. 분말용 ALD의 응용 및 전망
 References

• 최석(서울과학기술대학교 신소재공학과) | Seok Choi (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
• 한정환(서울과학기술대학교 신소재공학과) | Jeong Hwan Han (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
• 최병준(서울과학기술대학교 신소재공학과) | Byung Joon Choi (Department of Materials Science and Engineering, Seoul National University of Science and Technology) Corresponding Author