한국분말야금학회지 Vol. 27 No. 4 (p.333-338)

Plasma spray 공정을 이용한 BCuP-5 filler 금속/Ag 기판 복합 소재의 제조, 미세조직 및 접합 특성

Fabrication, Microstructure and Adhesive Properties of BCuP-5 Filler Metal/Ag Plate Composite by using Plasma Spray Process
키워드 :
Cu-15Ag-5P (BCuP-5),Plasma spray,Switching Device,Multi-layer,Bond strength

목차

Abstract
1. 서 론
2. 실험 방법
3. 결과 및 고찰
4. 결 론
References

초록

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu3P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/cm2. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.