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        검색결과 289

        182.
        2005.02 KCI 등재 구독 인증기관 무료, 개인회원 유료
        The copper oxide nano powders were synthesized by levitational gas condensation(LGC) method, and their high heterogeneous catalytic effects of oxidation of 2,3,5-trimethyl-1,4- hydroquinone (TMHQ) and catalase activity were studied. The observation of transmission electron microscopy (TEM) shows that most of these nano powders are uniform in size, with the average particle size of 35 nm. The nano powder consists of mainly , but it is aged to CuO phase. The catalytic effect which was clarified by oxidation of TMHQ and catalase depends on the amount of cuprite phase and the particle size.
        4,000원
        184.
        2004.12 KCI 등재 구독 인증기관 무료, 개인회원 유료
        Thermolysis of Cu(NO3)2·3H2O impregnated activated carbon fiber (ACF) was studied by means of XRD analysis to obtain Cu-impregnated ACF. Cu(NO3)2·3H2O was converted into Cu2O around 230℃. The Cu2O was reduced to Cu at 400℃, resulting in ACF-C(Cu). Some Cu particles have a tendency to aggregate through the heat treatment, resulting in the ununiform distribution in ACF. Catalytic decomposition of NO gas has been performed by Cu-impregnated ACF in a column reactor at 400℃. Initial NO concentration was 1300 ppm diluted in helium gas. NO gas was effectively decomposed by 5~10 wt% Cu-impregnated ACF at 400℃. The concentration of NO was maintained less than 200 ppm for 6 hours in this system. The ACF-C(Cu) deoxidized NO to N2 and was reduced to ACF-C(Cu2O) in the initial stage. The ACF-C(Cu2O) also deoxidized NO to N2 and reduced to ACF-C(CuO). This ACF-C(CuO) was converted again into ACF-C(Cu) by heating. There was no consumption of ACF in mass during thermolysis and catalytic decomposition of NO to N2 by copper. The catalytic decomposition was accelerated with increase of the reaction temperature.
        4,000원
        188.
        2003.12 KCI 등재 구독 인증기관 무료, 개인회원 유료
        The reduction mechanism of the composite powders mixed with and CuO has been studied by using thermogravimetry (TG), X-ray diffraction, and microstructure analyses. The composite powders were made by simple Turbula mixing, spray drying, and ball-milling in a stainless steel jar with the ball to powder ratio of 32 to 1 at 80 rpm for 1 h without process controlling agents. It is observed that all the oxide composite powders are converted to W-coated Cu composite powder after reducing treatment under hydrogen atmosphere. For the formation mechanism of W-coated Cu composite powder, the sequential reduction steps are proposed as follows: CuO contained in the ball-milled composite powder is initially reduced to Cu at the temperature range from 20 to 30. Then, powder is reduced to W via W and W at higher temperature region. Finally, the gaseous phase of formed by reaction of with water vapour migrates to previously reduced Cu and deposits on it as W reduced by hydrogen. The proposed mechanism has been proved through the model experiment which was performed by using Cu plate and powder.der.
        4,000원
        192.
        2003.03 KCI 등재 구독 인증기관 무료, 개인회원 유료
        연안지역의 환경오염 및 양식용수의 이용과정에 파생될 수 있는 구리의 오염에 따른 넙치의 생존, 대사율, 사료효율 및 성장율에 미치는 구리의 영향을 검토하였다. 4개의 아치사구리 농도(50, 80, 180, 320 μg L-1)에서 6주동안 실험하였다. 실험기간 동안 넙치는 대조구에서는 실험종료시 까지 사망개체가 전혀 나타나지 않아 100%의 생존율을 나타내었다. 구리 노출농도 180 μg L-
        4,000원
        193.
        2002.08 KCI 등재 구독 인증기관 무료, 개인회원 유료
        For the austenitic stainless steel (304L) manufactured by metal injection molding(MIM), the effects of copper content and sintering temperature on the mechanical properties, antibacterial activities, corrosion resistance, and electric resistances were investigated. The specimens were prepared by injection molding of the premixed powders of water-atomized 304 L and Cu with poly-acetyl binders. The green compacts were prepared with various copper contents from 0 to 10 wt.% Cu, which were debound thermally at 873 K for 7.2 ks in gas atmosphere and subsequently sintered at various temperatures from 1323 K to 1623 K for 7.2 ks in Ar gas atmosphere. The relative density and tensile strength of the sintered compacts showed the minimum values at 5 and 8 wt.% Cu, respectively. Both the relative density and the tensile strength of the specimen with 10 wt.% Cu sintered at 1373 K showed the highest values, higher than those of copper-free specimen. Antibacterial activities investigated by the plastic film contact printing method for bacilli and the quantitative analysis of copper ion dissolved in water increased as the increase of the copper content to stainless steels. It was also verified by the measurement of pitting potential that the copper addition in 304 L could improve the corrosion resistance. Furthermore the electric conductivity increased with the increase of copper content.
        4,000원
        195.
        2002.04 KCI 등재 구독 인증기관 무료, 개인회원 유료
        Nano Cu powders, synthesized by Pulsed Wire Evaporation (PWE) method, have been compacted by Magnetic Pulsed Cojpaction(MPC) method. The microstructure and mechanical properties were analyzed. The optimal condition for proper mechanical properties with nanostructure was found. Both pure nano Cu powders and passivated nano Cu powders were compacted, and the effect of passivated layer on the mechanical properties was investigated. The compacts by MPC, which had ultra-fine and uniform nanostructure, showed higher density of 95% of theoretical density than that of static compaction. The pur and passivated Cu compacted at exhibited maximum hardnesses of 248 and 260 Hv, respectively. The wear resistance of those compacts corresponded to the hardness.
        4,000원
        199.
        2001.07 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        황산구리 전해욕에 분산제인 콜로이달 실리카(SiO2현탁액)를 첨가시키는 분산도금의 방법과 Au pre-coating을 이용하여 음극에 석출하는 전해 석출물의 결정구조, 표면형상, 결정방향 등의 변화를 검토하였다. 실리카 분산 및 Au pre-coating에 의하여 전해 석출피막의 결정입자가 미세화 되고, 균일하게 성장됨은 물론, 결정 수가 증가하였다. 콜로이달 실리카의 분산 효과에 의해서 전해 석출피막의 경도가 대략 15%까지 상승하였다. 또한 콜로이달 실리카를 분산시킨 구리 전착층의 X-선 회절패턴이 (111)면, (200)면과 (311)면이 거의 소멸되어 우선 방위가 (111)에서 (110)면으로 변화되었다.
        4,000원
        200.
        2001.06 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        O2plasma와 H(hfac)을 이용한 Cu 박막의 건식 식각을 조사하였다. 휘발성이 큰 Cu(hfac)2와 H2O를 탈착시키기 위하여 O2 Plasma를 이용한 Cu 박막의 산화와 생성된 Cu 산화막을 H(hfac)과의 반응으로 제거하는 공정으로 식각을 수행하였다. Cu 박막의 식각율은 50-700 /min의 범위를 보였으며, 기판온도, H(hfac)/O2 유량비, plasma power에 따라 변하였다. Cu 박막의 식각율은 기판온도 215˚C보다 높은 온도구간에서 RF power가 증가함에 따라 증가하였고, 산화 공정과 H (hfac)과의 반응이 균형을 이루는 최적의 H (hfac)/O2 유량비는 1:1임을 확인하였다. Ti mask를 사용한 Cu Patterning은 유량비 1 : 1, 기판온도 250˚C에서 실시하였고, 30˚외 taper slope를 갖는 등방성 etching profile을 얻을 수 있었다. Taper angle을 갖는 Cu 건식 patterning은 고해상도의 대면적 thin film transistor liquid-crystal(TFT-LCDs)를 위래 필요한 것으로써 기판온도, RF power, 유량비를 조절한 one-step 공정으로부터 성공적으로 얻을 수 있었다.
        4,000원