본 연구는 인쇄회로기판(PCB) 제조 시 에칭공정에서 발생되는 구리이온(Cu+2)을 고농도로 함유한 황산 폐에칭액을 NF 막분리법을 사용하여 에칭액 회수와 구리이온 처리를 효율적으로 수행하기 위한 NF 막여과 공정의 운전 조건을 설정하기 위한 기본 자료를 확보하는데 있다. 이를 위해 미국 Koch사의 SelRO MPS-34 4040 NF 막을 대상으로 구리이온을 고농도(5~25 g/L)로 함유한 모의 황산 폐에칭액의 회분식(dead-end) 나노여과 실험을 수행하여 투과 플럭스와 구리이온의 총괄 배제도를 측정하였다. 이 결과 황산용액에의 막 보관기간이 길수록, 황산용액의 pH가 낮을수록 황산에 의한 NF 막의 손상이 더 크게 발생하여 순수 투과 플러스가 증가하였다. 황산 폐에칭액의 투과 플럭스는 황산용액 내 구리이온의 농도가 증가할수록 막 표면에의 구리이온 농축(농도분극)의 증가에 따라 감소하였으며, 구리이온의 배제도는 구리이온의 농도가 높을수록, pH가 낮을수록, 황산용액 내의 막 보관기간이 길수록 낮아져 초기 37%에서 최소 15% 수준으로까지 감소하였다.

Recovery of copper powder from copper chloride solution used in leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average in size.

The microstructure and mechanical properties of a copper alloy sheet processed by differential speed rolling (DSR) were investigated in detail. A copper alloy with thickness of 3 mm was rolled to a 50% reduction at ambient temperature without lubrication and with a differential speed ratio of 2.0:1. For comparison, conventional rolling (CR), in which the rolling speeds of the upper and lower rolls is 2.0 m/min, was also performed under the same rolling conditions. The shear strain of the sample processed by CR showed positive values at the positions of the upper roll side and negative values at the positions of the lower roll side. On the other hand, the sample processed by the DSR showed zero or positive shear strain values at all positions. However, the microstructure and mechanical properties of the as-rolled copper alloys did not show such significant differences between the CR and the DSR. The samples rolled by the CR and the DSR exhibited a typical deformation structure. In addition, the DSR processed samples showed a typical rolling texture in which 112<111>, 011<211> and 123<634> components were developed at all positions. Therefore, it is concluded that the DSR was very effective for the introduction of a uniform microstructure throughout the thickness of the copper alloy.

In this study, electrolytic copper powders were consolidated by high-pressure torsion process (HPT) which is the most effective process to produce bulk ultrafine grained and nanocrystalline metallic materials among various severe plastic deformation processes. The bulk samples were manufactured by the HPT process at 2.5 GPa and 1/2, 1 and 10 turns. After 10 turns, full densification was achieved by high pressure with shear deformation and ultrafine grained structure (average grain size of 677 nm) was observed by electron backscatter diffraction and a scanning transmission electron microscope.

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 μm in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/cm2, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/cm2 is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/cm2. A TSV with a diameter 10 μm and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/cm2 with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

P/M coppers are subjected to the isothermal compression tests at the strain rate ranging from 0.01 to 10.0 and the temperature from 200 to . The processing map reveals the dynamic recrystallization (DRX) domain in the following temperature and strain rate ranges: and 0.01-10.0 , respectively. In the domain, the region at temperature of and strain rate of shows peak efficiency. From the kinetic analysis, the apparent activation energy in the DRX domain is 190.67 kJ/mol and it suggests that lattice self-diffusion is the rate controlling mechanism.

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

The effects of conventional rolling (CR) and differential speed rolling (DSR) on the microstructure and mechanical properties of a copper alloy sheet were investigated in detail. A copper alloy with thickness of 3 mm was rolled to a 50% reduction at ambient temperature without lubrication with a differential speed ratio of 2:1; sample was then annealed for 0.5h at various temperatures from 100 to 800˚C. Conventional rolling, in which the rolling speed of the upper and lower rolls is identical, was performed under the same rolling conditions. The shear strain introduced by the CR showed positive values at positions on the upper roll side and negative values at positions on the lower roll side. However, the shear strain showed a zero or positive value at all positions for the samples rolled by the DSR. The microstrucure and mechanical properties of the as-rolled copper alloy did not show very significant differences between the CR and DSR for the microstructure and mechanical properties. However, those properties showed very significant differences in the case of the annealed samples. The effects of rolling method on the microstructure and mechanical properties of the as-rolled and subsequently annealed materials are discussed in terms of the shear strain.

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/cm2. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/cm2. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/cm2 considering the productivity and mechanical properties of copper foil.

한국원자력연구원 처분시스템개발과제에서는 처분용기 재료로 개발중인 저온분사코팅 구리에 대한 틈새부식(Crevice Corrosion) 시험을 실시하였다. 본 시험을 통하여 틈새에서의 부식의 발생여부와 발생되는 시점인 재부동태 전위(Repassivation Potential)를 측정하고자 하였다. 틈새부식 시험 방법으로 (1) ASTM G61-86 : Cyclic Potentiodynamic Polarization Measurements, (2) SWRI의 PotentiodynamicPolarization plus intermediate Potentiostatic Hold method, 그리고 (3) ASTM G192-08 (THE method) :Potentiodynamic- Galvanostatic -Potentiostatic Method 등의 3가지 방법을 소개하였다. 실제 저온분사코팅구리의 부식시험에서는 ASTM G61-86에 따라서 틈새부식장치를 설치하고, 저온분사 코팅구리가 KURT 지하수를 모사한 용액에서 어떻게 틈새부식이 일어나는지 살펴보았다. 전기적 부식조건으로는 Cyclic Polarization Test, Potentiostatic Polarization Test, 및 Electrochemical Impedance Spectroscopy등을 사용하였다. 그리고 부식이 된 시편에 대해 Profilometer Measurement를 통해 실제 부식표면의 높낮이를 조사하여 틈새부식 유무를 관찰하였다. 최종적인 결론에서는 저온분사코팅구리는 틈새부식을 나타나지 않는다는 것을 확인할 수 있었다. 그리고 시험에 사용된 세종류의 구리에 대한 상대적인 부식평가를 한 결과, 부식전위를 나타내는 개방회로(Open Cell)에서의 전위는 구리의 제조방식과 상관없이 구리의 순도가 높을수록 높은 값을 보이는 것을 확인할 수 있었다. 결론적으로 KURT 심층지하수 조건에서는 구리는 틈새부식이 발생되지 않는다고 결론지었다.

In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be . From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to . On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

본 실험은 구리가 흰줄숲모기, Aedes albopictus의 발생에 미치는 생물학적 영향을 조사하기 위하여 수행하였다. 흰줄숲모기 3령, 4령 유충을 각각 다른 농도의 구리 용액(0.0, 2.5, 25.0, 50.0 ppm)에서 24시간, 48시간 처리한 후 치사농도를 결정하고, 사육용액(tap water)으로 옮겨 사육하여, 유충의 용화율, 성충의 날개길이를 측정한 결과는 다음과 같다. 50% 치사농도(LC50)는 4령 유충 24시간 처리군

Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at 70˚C with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

This paper is a new method for prevent. The particulate scale. stero-microscope were used for the scale removal experiment to improve mineralogical characteristics and the reduction of scales in heat pipe. Generally, the scale in the heat pipe consists of calcium carbonate minerals, such as calcite and aragonite which are precipitated by the reaction of Ca and CO2 in the water. Copper alloy metal could eliminate the scale and prevent the production of scale in the heat pipe.

A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO leaching process. The first step consisted of replacing noble copper ions with external Fe ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 12m in size.

In order to establish an indoor-rearing system for Copper butterflies; Large Copper butterfly, Lycaena dispar, the effect of temperature, photoperiod on larval development was investigated. As temperature increased, the developmental period was gradually reduced. The developmental periods of Large Copper larvae was 11.0 days and 28.5 days at 30℃ and 17.5℃, respectively. We investigated the sensitivity of stages to diapause induction. The experiment involved transfer of individuals from diapause averting (LD 16:8 h, 25℃) to diapause inducing condition (LD 8:16 h, 20℃) at various stages. Daipause was induced in 95.2% insect transferred at hatching larvae, in 15.6% of insects transferred at 2nd stadium molt, in 0% of insects transferred at after 3rd stadium molt. Percentage of diapause induction increased with the length of short days and low temperature. The main sensitive stage to photoperiodic and temperature induction of diapause determination was the early first larval instar. The diapause sensitivity began 14 days and ended 20 days after hatching larvae. The main stage sensitive to photoperiodic induction of diapause determination was the early first larval instar under low temperature and short day length. In relation to diapause termination, pupation was accelerated with cold treatment after diapausing 15 to 20 days and suitable chilling temperature was 8℃.

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

This paper considers a six sigma project for reducing the cost copper of the cable materials in a electric wire company. The project follows a disciplined process of five macro phases: define, measure, analyze, improve, and control (DMAIC). A process map is used to identify process input variables. Three key process input variables are selected by using an input variables are selected by using an input variable evaluation table: large cable, plating, and a twisted pair. DOE is utilized for finding the optimal process conditions of the three key process input variables. The implementing result of this six sigma project is enable for reducing of the 2.8% copper materials.