Conversion to modern hydrogen energy is required, and research on liquefied hydrogen cargo containment systems is needed for large-capacity transport and storage. In this study, changes in the mechanical properties of the adhesive required for storage and transport in liquid hydrogen were confirmed. The lap shear test was performed by realizing cryogenic conditions in a small chamber using liquid nitrogen and liquid helium. There was an increase of 11.0% in the -180℃ condition compared to room temperature, and an increase of 1.8% in the -230℃ condition compared to the -180℃ condition was confirmed. In the case of shear strain, it is known that it decreases as the temperature goes down. As a result of the experiment, it was confirmed that the value at room temperature and the value at -180℃ reduced the shear strain by 5.0%, and -230˚ compared to the -180℃ condition. An increase of 1.5% was confirmed in the C condition. In the case of the specimen tested at -230℃, the deformation in the gripper part was larger than in other tests, and it is judged that the maximum shear strength and shear strain were affected. In addition, in this study, there is a limitation in the experiment at -230°C rather than 253°C, which is the boiling point of hydrogen

In modern times, where problems due to environmental pollution are continuously occurring, hydrogen is in the spotlight as the energy of the future. Hydrogen is an eco-friendly energy resource that does not even generate CO2, and is actively supporting research to utilize hydrogen energy at the national level. This study is a study on the cryogenic mechanical properties of the elements constituting the cargo hold during the transportation of liquid hydrogen. Among the various components, the evaluation of mechanical properties of the cryogenic adhesive under liquid helium conditions was confirmed. The related contents are summarized as follows. As a result of performing SSRT by curing the adhesive, it was confirmed that tensile strength and maximum strain were increased at cryogenic temperature (-230°C) compared to room temperature (25°C). It was confirmed that the adhesive-hardened specimen showed a brittle fracture mode at both room temperature and cryogenic temperature during tensile. Improvements in this study, such as pores occurring during adhesive curing, the use of standard specimens, and experiments at -253°C, the boiling point of hydrogen, exist, and are planned to be carried out in subsequent studies.

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.