A Cu-15Ag-5P filler metal (BCuP-5) is fabricated on a Ag substrate using a high-velocity oxygen fuel (HVOF) thermal spray process, followed by post-heat treatment (300oC for 1 h and 400oC for 1 h) of the HVOF coating layers to control its microstructure and mechanical properties. Additionally, the microstructure and mechanical properties are evaluated according to the post-heat treatment conditions. The porosity of the heat-treated coating layers are significantly reduced to less than half those of the as-sprayed coating layer, and the pore shape changes to a spherical shape. The constituent phases of the coating layers are Cu, Ag, and Cu-Ag-Cu3P eutectic, which is identical to the initial powder feedstock. A more uniform microstructure is obtained as the heat-treatment temperature increases. The hardness of the coating layer is 154.6 Hv (as-sprayed), 161.2 Hv (300oC for 1 h), and 167.0 Hv (400oC for 1 h), which increases with increasing heat-treatment temperature, and is 2.35 times higher than that of the conventional cast alloy. As a result of the pull-out test, loss or separation of the coating layer rarely occurs in the heat-treated coating layer.

Synthesis of nanosilver particles were obtained by chemical reduction of silver nitrate and capping agent. The solution containing nanoparticles were coated on polyvinylidene fluoride (PVDF) hollow fiber membranes which the membranes were measured water permeation flux and antibacterial activities. The resonance peak of the Ag/PVA core shell nanoparticle indicated at 430 nm in the UV-visible spectra. The Ag/PVA coated PVDF membrane exhibited excellent antibacterial performance over 60 days, and water permeation flux (LMH) was observed from 700 to 1400.

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of Cu2O or Cu(OH)2 layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.