In this study, we analyzed the radiant heat performance of ballast fin when the aspect ratio of the fin of ballast was changed. The minimum size of the mesh was 0.02 mm, and the grid number was about more than 11 thousand. In order to analyze the radiant heat performance of ballast fin, the aspect ratio of fin was 1.00(2 mm:2 mm), 1.80(1.5 mm:2.7 mm), and 0.56(2.7 mm:1.5 mm) respectively; that the heat transfer area was constantly 0.4 mm 2 . The numerical condition was that heat flux was constantly 1×10 5 W/m 2 , and measuring times were 0.1 second, 0.2 second, 0.5 second, 2 seconds, 5 seconds and 10 seconds respectively. The temperature values of fin at the 1.00 and 1.80 of aspect ratios were extremely large when heat flux time was 10 seconds. As a result, the maximum value of radiant heat performance of ballast fin appeared to the aspect ratio of 1.80.

LED industry in the world, is rapidly emerging as an important policy means of each countries for climate change, saving energy and international environmental regulations. And incandescent bulb regulatory policy in each country is the role of growth catalysts for the LED lamp industry, it is expected to increase research and investment for the LED package in the future. However, In spite of the growth of the LED lamp industry, the price of the world LED lamp has been declining more than 30% per year and it is accelerating further. Therefore, an alternative techniques for high performance and cost reduction of the LED lamp has been studied. In this study, we studied the aluminum extrusion product inserted heat sink as a one of the alternative techniques which can improve the thermal efficiency and reducing costs. As a result, radiant heat effect was improved around 44.5% higher than the thermally conductive resin heat sink

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.