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        검색결과 4

        1.
        2013.10 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.
        4,000원
        3.
        2005.02 KCI 등재 서비스 종료(열람 제한)
        Thermal neutrality is not enough to achieve thermal comfort. The temperature level can be the optimal, and still people may complain. This situation is often explained by the problem of local discomfort. Local discomfort can be caused by radiant asymmetry, local air velocities, too warm and too cold floor temperature and vertical temperature difference. This temperature difference may generate thermal discomfort due to different thermal sensation in different body parts. Therefore, thermal comfort can not be correctly evaluated without considering these differences. This study investigates thermal discomfort sensations of different body parts and its effect on overall thermal sensation and comfort in air-heating room. Experimental results of evaluating thermal discomfort at different body parts in an air-heating room showed that thermal sensation on the shoulder was significantly related to the overall thermal sensation and discomfort. Although it is known that cool-head, warm-foot condition is good for comfort living, cool temperature around the head generated discomfort
        4.
        2005.02 KCI 등재 서비스 종료(열람 제한)
        Draft is defined as an unwanted local cooling of the human body caused by air movement. It is a serious problem in many ventilated or air conditioned buildings. Often draft complaints occur although measured velocities in the occupied zone maybe lower than prescribed in existing standards. Purpose of this study is to clarify the evaluation of thermal comfort based on temperature and air velocity in winter. Experiments were performed in an environmental chamber in winter. Indoor temperature and air velocity was artificially controlled. The experiments were performed to evaluate temperature conditions and air velocity conditions by physiological and psychological responses of human. According to physiological responses and psychological responses, it was clear that the optimum air velocity is about 0.15 m/s and 0.30 m/s.