The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

Prediction of the behavior of heavy metals over time is important to evaluate the heavy metal toxicity in algae species. Various modeling studies have been well established, but there is a need for an improved model for predicting the chronic effects of metals on algae species to combine the metal kinetics and biological response of algal cells. In this study, a kinetic dynamics model was developed to predict the copper behavior (5 μg L-1, 10 μg L-1, and 15 μg L-1) for two freshwater algae (Pseudokirchneriella subcapitata and Chlorella vulgaris) in the chronic exposure experiments (8 d and 21 d). In the experimental observations, the rapid change in copper mass between the solutions, extracellular and intracellular sites occurred within initial exposure periods, and then it was slower although the algal density changed with time. Our model showed a good agreement with the measured copper mass in each part for all tested conditions with an elapsed time (R 2 for P. subcapitata: 0.928, R 2 for C. vulgaris: 0.943). This study provides a novel kinetic dynamics model that is compromised between practical simplicity and realistic complexity, and it can be used to investigate the chronic effects of heavy metals on the algal population.

The preparation of graphene oxide and the modification of its surface directly with copper pentacyanonitrosylferrate (III) nanoparticles are presented in this work, as well as the characterization of the materials using Fourier-transform infrared spectra, X-ray diffractometry and scanning electron microscopy techniques. Beyond that, the study on the electrochemical behavior of the dispersed bimetallic complex on the graphene oxide, as known as GOCuNP, surface was carried out by the cyclic voltammetry technique. The graphite paste electrode modified with GOCuNP was successfully applied in the detection of hydrazine, presenting limit of detection of 1.58 × 10–6 mol L−1 at concentration range of 1.00 × 10–5 to 5.00 × 10–3 mol L−1 of hydrazine, being so the proposed bimetallic complex formed can be considered as a potential candidate for the manufacturing of electrochemical sensors for hydrazine detection.

This study is aimed to analyze the economic feasibility of yellowtail culture using the copper alloy net cage in Gyeongsangbuk-do. First of all, in order to evaluate the copper alloy net cage on yellowtail culture, I review the trend on the yellowtail culture industry and research the concept of copper alloy net cage. The copper-alloy net cage is now recognized as an advantages of its system stability, recycling, antibiosis and food safety. The results were summarized as follows: first, there was significant meaning of the profit model of yellowtail culture by the price difference. Second, I analyzed in the economic feasibility of yellowtail culture using the copper alloy net cage, internal rate of return (IRR) was 51.58%, a benefit-cost ratio was shown to be 2.27 and net present value (NPV) was 1,087,337 thousand won, which indicates the economic feasibility of yellowtail culture using the copper alloy net cage is profitable. Finally, in order to improve the economic valuation, it is necessary to focus more on the developing of technology and cost reduction strategy on the copper alloy net cage.

Dry etching of copper thin films is performed using high density plasma of ethylenediamine (EDA)/ hexafluoroisopropanol (HFIP)/Ar gas mixture. The etch rates, etch selectivities and etch profiles of the copper thin films are improved by adding HFIP to EDA/Ar gas. As the EDA/HFIP concentration in EDA/HFIP/Ar increases, the etch rate of copper thin films decreases, whereas the etch profile is improved. In the EDA/HFIP/Ar gas mixture, the optimal ratio of EDA to HFIP is investigated. In addition, the etch parameters including ICP source power, dc-bias voltage, process pressure are varied to examine the etch characteristics. Optical emission spectroscopy results show that among all species, [CH], [CN] and [H] are the main species in the EDA/HFIP/Ar plasma. The X-ray photoelectron spectroscopy results indicate the formation of CuCN compound and C-N-H-containing polymers during the etching process, leading to a good etch profile. Finally, anisotropic etch profiles of the copper thin films patterned with 150 nm scale are obtained in EDA/HFIP/Ar gas mixture.

In this paper, an approach developed by the Finnish nuclear waste management organization, Posiva, for the construction license of a geological repository was reviewed. Furthermore, a computer program based on the approach was developed. By using the computer program, the lifetime of a copper disposal canister, which was a key engineered barrier of the geological repository, was predicted under the KAERI Underground Research Tunnel (KURT) geologic conditions. The computer program was developed considering the mass transport of corroding agents, such as oxygen and sulfide, through the buffer and backfill. Shortly after the closure of the repository, the corrosion depths of a copper canister due to oxygen in the pores of the buffer and backfill were calculated. Additionally, the long-term corrosion of a copper canister due to sulfide was analyzed in two cases: intact buffer and eroded buffer. Under various conditions of the engineered barrier, the corrosion lifetimes of the copper canister due to sulfide significantly exceeded one million years. Finally, this study shows that it is necessary to carefully characterize the transmissivity of rock and sulfide concentration during site characterization to accurately predict the canister lifetime.

In this study, Bacillus sp. SRCM 112835 was isolated from soybean paste (Doenjang, Korean Fermented Soy Paste). Bacillus sp. SRCM 112835 showed biosorption of the Cu (II) in aqueous solution. The strain effectively absorbed 30.2% of the Cu (II) from a 52.3 mg/L within 60 min. The properties of the Bacillus sp. SRCM 112835 were investigated by Fourier transform infrared spectroscopy (FT-IR), point of zero charge (pHpzc), and phylogenetic analysis. The influence of initial pH (2.08-9.98) and biomass dosage (0.005-0.07 g) were likewise probed. Isotherm and kinetic experiment results suggested that the Langmuir isotherm and pseudo-second-order kinetic models well-fitted the experimental data, respectively.

Carbon short fibers/copper composites with different carbon short fiber contents up to 15 wt.% as reinforcements are prepared to investigate the influence of the carbon short fiber surface coating on the microstructure, density, and electrical properties of the carbon short fibers/copper composites. The carbon short fibers were surface treated by acid functionalization followed by alkaline treatment before the coating process. It was observed from the results that coated type copper nanoparticles were deposited on the surface of the carbon short fibers. The surface treated carbon short fibers were coated by copper using the electroless deposition technique in the alkaline tartrate bath by using formaldehyde as a reducing agent of the copper sulfate. The produced coated carbon short fibers/copper composite powders were cold compacted at 600 MPa, and then sintered at 875 °C for 2 h under (hydrogen/nitrogen 1:3) atmosphere. A reference copper sample was also prepared by the same method to compare between the properties of pure copper and the carbon short fibers/copper composites. The phase composition, morphology, and microstructure of the prepared carbon short fibers/copper composite powders as well as the corresponding carbon short fibers/copper composites were investigated using X-ray diffraction analysis (XRD) and scanning electron microscope (SEM) equipped with an energy-dispersive spectrometer (EDS), respectively. The density and the electrical resistivity of the sintered composites were measured. It was observed from the results that the density was decreased; however, the electrical resistivity was increased by increasing the carbon short fibers wt.%.

본 연구에서는 건조 고춧가루의 가공 및 저장라인에서 구리의 이용가능성을 조사하였다. 구리와 스테인리스강 표면과의 접촉을 통한 고춧가루의 색도 변화를 평가한 결과, 55oC에서 2시간 구리 판에 처리한 시료의 명도가 다소 증가하였다. 구리와 스테인리스강 접촉에 의한 고춧가루 내 미생물 저해는 중온성의 호기성 세균보다 곰팡이 및 효모의 저해에 더 효과적이었고, 55oC에서 2시간 구리 접촉에 의해 곰팡이와 효모의 수는 0.64 log 감소하여 유의적인 효과를 나타내었다. 산화방지 활성은 구리와 스테인리스 강 접촉 고춧가루의 DPPH 라디칼 소거활성은 감소한 반면 ABTS 라디칼 소거활성은 증가하였다. 본 연구는 구리 또는 구리와 스테인리스강 등의 합금을 이용하여 고춧가 루를 포함한 다양한 분말 식품의 가공 및 저장 과정에 활용할 수 있는 가능성을 제시하고 있다.

The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C56H68Cl4CuN16S4). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 μm. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m−1K−1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10−6 to 3.06 × 10−6 K−1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

스프링클러설비에서 누수 하자가 발생되면 설비의 작동을 멈추는 경향이 많고 이는 입주자의 안전에 많은 지장을 초래하게 되며, 누수피해로 재산상의 손실도 발생하게 되므로 스프링클러설비는 화재진압 성능뿐만 아니라 내구성도 높아야 할 것이다. 동관 부식은 스프링클러설비 배관에서 주로 나타나는 특이한 현상으로서 그 동안 제시된 여러 학설들과 법원의 판단 등을 종합하여 검토한 결과, 동관의 부식은 매우 복합적인 요인에 의해 발생되고 있고, 하자보수 방법의 결정요인의 핵심은 보완시공을 통한 부식억제의 가능성 여부를 판단하는 것인데 실증적용 사례 연구 등을 통한 결론을 도출 하였다. 또한 스프링클러설비의 설비의 내구성 강화에 대한 법규적 미비점에 대해서도 연구를 통한 개선방안을 제시하여 향후 하자발생을 줄이고자 하였다.

Transparent conducting electrodes are essential components in various optoelectrical devices. Although indium tin oxide thin films have been widely used for transparent conducting electrodes, silver nanowire network is a promising alternative to indium tin oxide thin films owing to its lower processing cost and greater suitability for flexible device application. In order to widen the application of silver nanowire network, the electrical conductance has to be improved while maintaining high optical transparency. In this study, we report the enhancement of the electrical conductance of silver nanowire network transparent electrodes by copper electrodeposition on the silver nanowire networks. The electrodeposited copper lowered the sheet resistance of the silver nanowire networks from 21.9 Ω/□ to 12.6 Ω/□. We perform detailed X-ray diffraction analysis revealing the effect of the amount of electrodeposited copper-shell on the sheet resistance of the core-shell(silver/copper) nanowire network transparent electrodes. From the relationship between the cross-sectional area of the copper-shell and the sheet resistance of the transparent electrodes, we deduce the electrical resistivity of electrodeposited copper to be approximately 4.5 times that of copper bulk.

Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of Cu2SO4 and H2SO4 at a current density of 10 mA/cm2. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about 80 μm. The contact resistance of the copper electrode is 0.89 mΩ·cm2, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are 1 Ω/□ and 40 Ω/□, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.