We propose a novel stripping solution containing acids (HCl and HNO3), an oxidant [(NH4)2S2O8], and complexing agents (NaCl and citric acid) to remove surface passivation layers from 14K gold alloys fabricated using an investment casting process. The optimized solution employing only HCl acid is determined by varying molar fractions of HCl and HNO3 on 14K yellow gold samples. Stripping properties are also identified for red and white gold alloy samples under the optimized stripping conditions. The removal of passivation layers, weight loss, and microstructure evolution are characterized using Raman spectroscopy, a precision scale, and optical microscopy. The proposed stripping solution effectively removes passivation layers more rapidly than conventional cyanide stripping. Weight loss increases linearly for up to 5 min for all 14K gold alloys. Red gold exhibits the greatest weight loss, followed by yellow gold and white gold. The results of microstructural analysis reveal that the conformal stripping occurs according to time. These results imply that the proposed oxidative chloride stripping might replace conventional cyanide stripping.

The property changes of 18, 14, and 8K green gold alloys for jewelry are observed by adding 0.0, 3.0, and 5.0 wt% of indium (In), respectively. To check the composition of the alloys, an energy dispersive spectroscopy (EDS) analysis is conducted. Color and microstructure analysis is executed through bare-eye, macro camera, UV-VIS-NIR-colormeter, and optical microscope. The melting point, wetting angle, and hardness are measured using TGA-DTA, a wetting angle tester, and a Vickers hardness tester. The EDS analysis result demonstrates that each of the green gold alloys was manufactured with purposed contents. The color analysis result shows that the color of the alloys is similar to the color of the conventional 4 wt%- Cd 18K green gold, and the green color improves as the In content increases. The micro structure analysis result demonstrates that grain refinement improves as the amount of In increases. Enhancements in the melting point, wettability, and Vickers hardness changes appear as the In content increases and Au content decreases. The hardness is up to 260, which implies good durability. Therefore, the results suggest that the proposed 18, 14, and 8K In-added green gold alloys enhance the properties of jewelry products with regard to the green color, castability, and durability.

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.

We prepared 8 samples of non-silver and silver-added master alloys containing silicon to confirm the existence of nickel-silicides. We then prepared products made of 14K and 18K white gold by using the prepared master alloys containing 0.25, 0.35, and 0.50 wt% silicon to check for nickel release. We then employed the EN 1811 testing standard to investigate the nickel release of the white gold products, and we also confirmed the color of the white gold products with an UV-VISNIR- color meter. We observed NiSix residue in all master alloys containing more than 0.50 wt% Si with EDS-nitric acid etching. For the white gold products, we could not confirm the existence of NiSix through XRD after aqua regia etching. In the EN 1811 test, only the white gold products with 0.25 wt% silicon master alloys successfully passed the nickel release regulations. Moreover, we confirmed that our white gold products showed excellent Lab indices as compared to those of commercial white gold ones, and the silver-added master alloys offered a larger L index. Our results indicate that employing 0.25 wt% silicon master alloys might be suitable for white gold products without nickel-silicide defects and nickel release problems.