This study was carried out to investigate the proper wattage and installation distance for the efficient use of nano-carbon fiber infrared heating lamp (NCFIHL), a heating device advantageous for heating energy saving, when the production of watermelon plug seedlings in the plug seedling nursery in winter season. Six small beds were divided into plastic film, and 700 W and 900 W nano-carbon fiber infrared heating lamps were installed at 100 cm above the bed. 1 lamp at central (control), 60 cm interval (2 lamps), and 40 cm interval (3 lamps) heating lamps were installed in each bed inside the greenhouse. All treatments, except the control, were set to keep the night air temperature at 20℃ after lighting the NCFIHL. The leaf temperature showed a tendency to increase fast as the install distance was narrow. The leaf length and leaf width tended to increase as the installation distance of the 700 W heating lamp was narrow. The compactness was high in 700 W heating lamp with 40 cm of installation distance. Therefore, in consideration of maintaining the set temperature at night, installing 700 W electric lamps at 40 cm was an efficient power and installation distance for watermelon grafted seedlings considering economic feasibility.

동절기에 공정육묘장에서 난방 에너지 절감과 우량묘 생산을 위해 나노탄소섬유적외선 난방등(NCFIHL, nanocarbon fiber infrared heating lamp)의 적정 전력과 설치 높이를 구명하는 것이 본 연구의 목적이다. 벤로형 유리 온실 내부에 수박 접목묘를 재배하기 위해 700과 900W NCFIHL을 육묘 베드(1.2 × 2.4m)에서 0.7, 1.0, 및 1.3m 높이로 각각 설치하였다. 수박(Citrullus lanatus (Thunb.) Manst.) ‘지존꿀’과 박(Lagenaria leucantha Rusby.) ‘선봉장’은 각각 접수와 대목으로 사용되었다. 접수와 대목은 편엽합접 방식으로 접목되었다. NCFIHL의 광도는 모든 처리에서 1μmol·m-2·s-1 이하였다. NCFIHL의 광분포는 대부분 적외선 영역에서 나타났다. 외기온도가 10oC 이하일 때 700과 900W NCFIHL을 0.7m 높이로 설치한 처리구와 900W NCFIHL을 1.0m 높이로 설치한 처리에서 야간 설정온도(20oC)를 유지하였다. 열화상 촬영에서는 900W NCFIHL을 0.7m 높이로 설치한 처리에서 가장 빨리 식물체의 온도가 올라갔다. Compactness는 700W NCFIHL을 1.3m 높이로 설치한 처리에서 우수하였다. 결과적으로 700W NCFIHL을 1.0m 이상으로 설치하는 것이 바람직하다고 판단된다.

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature (300 oC) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.