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Hydroxyapatite가 도핑된 Ti-6Al-4V 구형 분말의 전기방전 소결 및 소결체 특성에 관한 연구 KCI 등재

A Study of Electro-Discharge-Sintering of Ti-6Al-4V Spherical Powders Doped with Hydroxyapatite by Spex Milling and Its Consolidation Characteristics

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한국분말야금학회지 (Journal of Korean Powder Metallurgy Institute)
한국분말재료학회(구 한국분말야금학회) (Korean Powder Metallurgy Institute)
초록

Spherical Ti-6Al-4V powders in the size range of 250 and 300 µm were uniformly doped with nano-sized hydroxyapatite (HAp) powders by Spex milling process. A single pulse of 0.75-2.0 kJ/0.7 g of the Ti-6Al-4V powders doped with HAp from 300 mF capacitor was applied to produce fully porous and porous-surfaced Ti-6Al-4V implant compact by electro-discharge-sintering (EDS). The solid core was automatically formed in the center of the compact after discharge and porous layer consisted of particles connected in three dimensions by necks. The solid core increased with an increase in input energy. The compressive yield strength was in a range of 41 to 215 MPa and significantly depended on input energy. X-ray photoelectron spectroscopy and energy dispersive x-ray spectrometer were used to investigate the surface characteristics of the Ti-6Al-4V compact. Ti and O were the main constituents, with smaller amount of Ca and P. It was thus concluded that the porous-surfaced Ti-6Al-4V implant compacts doped with HAp can be efficiently produced by manipulating the milling and electro-discharge-sintering processes.

저자
  • 조유정(Division of Nano and Advanced Materials Engineering, Sejong University) | Y. J. Cho
  • 김영훈(Department of Dental Laboratory Technology, Wonkwang Health Science University) | Y. H. Kim
  • 조예현(Division of Nano and Advanced Materials Engineering, Sejong University) | Y. H. Jo
  • 김민재(Division of Nano and Advanced Materials Engineering, Sejong University) | M. J. Kim
  • 김현수(Gyeonggi Science High School for the Gifted) | H. S. Kim
  • 김승우(Gyeonggi Science High School for the Gifted) | S. W. Kim
  • 박정환(Gyeonggi Science High School for the Gifted) | J. H. Park
  • 이원희(Division of Nano and Advanced Materials Engineering, Sejong University) | W. H. Lee Corresponding Author