In this study, the feasible test for the mechanical property characterization of ceramics and multi-layer ceramic capacitor(MLCC) was performed with nanoindentation technique. In case of ceramics, hardness and elastic modulus are dependent on the densification of specimen showing the highest hardness and elastic modulus values of 12.3 GPa and 155 GPa, respectively at . In case of MLCC chip, hardness of dielectric layer was lower than that of margin region. The nanoindentation method could be useful tool for the measurement of mechanical property within dielectric layer of very thin thickness in high capacitance MLCC