Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu (0.1 μm and 7 μm) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at 75 oC. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from 0.1 μm Cu particles increased by 192.5% and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

1. 서 론
 2. 실험 방법
  2.1 시약
  2.2 산화구리 분말 제조
  2.3 방열 컴파운드 제조
  2.4 X선 회절 분석
  2.5 전계방사형 주사전자현미경/에너지 분산형 X선 분석
  2.6 이온빔 집속장치
  2.7 열전도도 분석
  2.8 절연파괴전압 분석
 3. 실험 결과 및 고찰
  3.1 산화구리 특성 분석
  3.2 방열 컴파운드의 열전도도 특성 분석
  3.3 방열 컴파운드의 절연파괴전압 특성 분석
 4. 결 론
 Acknowledgement
 References

• 이동우((주) 영일 프레시젼) | Dong Woo Lee
• 엄창현((주) 영일 프레시젼) | Chang Hyun Um
• 주제욱((주) 영일 프레시젼) | Jae Uk Chu Corresponding author