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주물공정 악취·분진 동시 처리를 위한 여과 집진장치 개발연구 KCI 등재

Simultaneous Removal of TVOC and Particulate Matters Using Rectangular Bag-Filter System with for a Foundry

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한국환경과학회지 (Journal of Environmental Science International)
한국환경과학회 (The Korean Environmental Sciences Society)
초록

Foundry has an important economic value in the industry. However, the generation of air pollutants like particulate and odor are serious. Due to the unavoidable usage of molding sand, particulate occurs in almost all the processes. That accounts for the majority of respirable dust in the size less than 10 ㎛. As well as particulate, over 22 species of odor-causing gases and VOCs including hydrogen sulfide and ammonia are occurred. Therefore, the development of equipment that can simultaneously remove TVOC and particulate is regarded as an essential research. In this study, the spraying absorbent system was connected with the shear bag filter for the purpose to remove TVOC and particulate simultaneously. Maximization of process efficiency for the affective factors like the powder combination and injection method is conducted. The experiment was performed at the de-molding process of one foundry plant. Through these devices, the removal efficiency of more than 95% for TVOC was achieved with the absorbent that composed by 800 mesh Activated carbon (80%) and 300 mesh zeolite (20%). Also, the durability and economic evaluation were assessed. In the result of Durability assessment, the available recovery to maintain the deodorizing effect at 90% was counted to 350 degree.

목차
Abstract
 1. 서 론
 2. 연구방법
  2.1 실험장치 설계 및 제작
  2.2. 탈취제 선정
  2.3. 오염원 선정과 TVOC 측정방법
  2.4. 실험 조건 및 Case
 3. 연구결과 및 고찰
  3.1. 실험 결과
  3.2. 고찰
 4. 결론
 감사의 글
 참고문헌
저자
  • 허영빈(창원대학교 환경공학과) | Rong-Bin Xu (Department of Environmental Engineering, Changwon National University) Corresponding author
  • 김태형(창원대학교 환경공학과) | Tae-Hyeung Kim (Department of Environmental Engineering, Changwon National University)
  • 하현철((주)벤텍) | Hyun-Chul Ha (Ventech Corp., Changwon National University)
  • 박승욱((주)벤텍) | Cheng-Xu Piao (Ventech Corp., Changwon National University)