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Dynamic Precipitation and Substructure Stablility of Cu Alloy during High Temperature Deformation KCI 등재 SCOPUS

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한국재료학회지 (Korean Journal of Materials Research)
한국재료학회 (Materials Research Society Of Korea)
초록

Structural and mechanical effects of the dynamical precipitation in two copper-base alloys have been investigated over a wide range of deformation temperatures. Basing upon the information gained during the experiment, also some general conclusion may be formulated. A one concerns the nature of dynamic precipitation(DP). Under this term it is commonly understood decomposition of a supersaturated solid solution during plastic straining. The process may, however, proceed in two different ways. It may be a homogeneous one from the point of view of distribution and morphological aspect of particles or it may lead to substantial difference in shape, size and particles distribution. The effect is controlled by the mode of deformation. Hence it seems to be reasonable to distinguish DP during homogeneous deformation from that which takes place in heterogeneously deformed alloy. In the first case the process can be analyzed solely in terms of particle-dislocation-particle interrelation. Much more complex problem we are facing in heterogeneously deforming alloy. Deformation bands and specific arrangement of dislocations in form of pile-ups at grain boundaries generate additional driving force and additional nucleation sites for precipitation. Along with heterogeneous precipitation, there is a homogeneous precipitation in areas between bands of coarse slip which also deform but at much smaller rate. This form of decomposition is responsible for a specially high hardening rate during high temperature straining and for thermally stable product of the decomposition of alloy.

목차
Abstract
 1. Introduction
 2. Experimental Procedure
  2.1 Material
  2.2. Testing
  2.3 Structure observations
  2.4 Annealing of B-alloy
 3. Results and Discussion
 4. Conclusions
 References
저자
  • Chang-Suk Han(Dept. of ICT Automotive Engineering, Hoseo University) Corresponding author
  • Dong-Nyeok Choi(Dept. of ICT Automotive Engineering, Hoseo University)
  • Sung-Yooun Jin(Dept. of ICT Automotive Engineering, Hoseo University)