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써멀 그리스의 열전달계수에 따른 CPU 온도변화에 관한 비교 KCI 등재

Comparison of CPU Temperature Change According to the Heat Transfer Coefficient of Thermal Grease

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한국기계기술학회지 (Journal of the Korean Society of Mechanical Technology)
한국기계기술학회 (Korean Society of Mechanical Technology)
초록

In this study, the effect of thermal grease and heat sink material of cooler on CPU temperature was measured and compared with LinX(v0.9.6) and HWMonitor.When the computer is booted without thermal grease applied, the CPU temperature rises rapidly, and the CPU temperature reaches 100℃ after 60 seconds for aluminum heat sink and 140 seconds for copper heat sink. The CPU temperature is lower as the thermal conductivity coefficient of thermal grease is higher, and the CPU temperature is lower when the thermal conductivity coefficient of the cooler is higher. In addition, when using a thermal grease and a heat sink with a high coefficient of thermal conductivity, the cooler rpm can be lowered, which is considered to be advantageous in terms of system stability and energy saving.

저자
  • 심재웅(한라대학교) | J. W. Shim
  • 조홍종(한라대학교) | H. J. Jo
  • 조규창(한라대학교) | G. C. Cho
  • 곽준재(한라대학교) | J. J. Kwak
  • 금성민(한라대학교) | Sung Min Kum Corresponding Author