The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/ glass. Finally, the confidence interval is 95 ± 1.959 %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.

Abstract
1.서 론
2. 실험방법
3. 결과 및 고찰
4.결 론
References

• 최진삼(울산산학융합원) | Jin Sam Choi (Ulsan Industry University Convergence Institute) Corresponding author
• 다타치카 나까야마(나가오카기술대학) | Tadachika Nakayama (Dept. of Electrical Engineering/Electronic Devices and Optical Electronics Group, Nagaoka University of Technology)