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A Case Study for Estimating the Defect Rate of PLC Using Sampling Inspection and Improving the Cause of Defects KCI 등재

샘플링검사를 이용한 PLC의 불량률 추정 및 불량원인 개선 사례연구

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한국산업경영시스템학회지 (Journal of Society of Korea Industrial and Systems Engineering)
한국산업경영시스템학회 (Society of Korea Industrial and Systems Engineering)
초록

WDM(Wavelength Division Multiplexing) is called a wavelength division multiplexing optical transmission method and is a next-generation optical transmission technology. Case company F has recently developed and sold PLC(Planar Lightwave Circuit), a key element necessary for WDM system production. Although Chinese processing companies are being used as a global outsourcing strategy to increase price competitiveness by lowering manufacturing unit prices, the average defect rate of products manufactured by Chinese processing companies is more than 50%, causing many problems. However, Chinese processing companies are trying to avoid responsibility, saying that the cause of the defect is the defective PLC Wafer provided by Company F. Therefore, in this study, the responsibility of the PLC defect is clearly identified through estimating the defect rate of PLC using the sampling inspection method, and the improvement plan for each cause of the PLC defect for PLC yeild improvement is proposed. The result of this research will greatly contribute to eliminating the controversy over providing the cause of defects between global outsourcing companies and the head office. In addition, it is expected to form a partnership with Company F and a Chinese processing company, which will serve as a cornerstone for successful global outsourcing. In the future, it is necessary to increase the reliability of the PLC yield calculation by extracting more precisely the number of defects.

목차
1. 서 론
2. 이론적 배경
    2.1 WDM 시스템
    2.2 샘플링 검사
    2.3 기존연구 고찰
3. PLC 불량률 추정 및 수율계산
    3.1 PLC 부적합 현황
    3.2 샘플링검사 실시 및 결과
    3.3 PLC 불량률 추정
    3.4 PLC 수율계산
4. PLC 부적합 원인별 개선방안
    4.1 입력단 과연마(Over Grinding)
    4.2 측정불량(Measurement Error)
    4.3 출력단 파손(Breakage)
    4.4 입출력단면 가공불량(Fail Polishing)
    4.5 이물질(Foreign Substance)
5. 결 론
References
저자
  • In-Sun Moon(한밭대학교 산업경영공학과) | 문인선
  • Dong-Hyung Lee(한밭대학교 산업경영공학과) | 이동형 Corresponding Author