In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 μm, and the surface fluctuation is measured as approximately 3.2 μm. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.

Abstract
1. 서 론
2. 실험 방법
3. 결과 및 고찰
4. 결 론
감사의 글
References

• 주연아(인하대학교 신소재공학과) | Yeun A Joo (Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea)
• 조용훈(인하대학교 신소재공학과) | Yong-Hoon Cho (Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea)
• 박재성(LT 메탈㈜) | Jae-Sung Park (LT Metal LTD., Incheon 22828, Republic of Korea)
• 이기안(인하대학교 신소재공학과) | Kee-Ahn Lee (Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea) Corresponding Author