Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn–Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

Abstract
1. 서 론
2. 실험 방법
3. 결과 및 고찰
    3.1 세척여부에 대한 결과의 비교
    3.2 세척량에 대한 결과의 비교
4. 결 론
감사의 글
References

• 정승재(한국재료연구원 금속분말연구실) | Seong-Jae Jeong (Metal Powder Department, Korea Institute of Materials Science (KIMS))
• 장미세(한국재료연구원 금속분말연구실) | Mi-Se Chang (Metal Powder Department, Korea Institute of Materials Science (KIMS))
• 정재원(한국재료연구원 금속분말연구실) | Jae-Won Jeong (Metal Powder Department, Korea Institute of Materials Science (KIMS))
• 양상선(한국재료연구원 금속분말연구실) | Sang-Sun Yang (Metal Powder Department, Korea Institute of Materials Science (KIMS))
• 권영태(한국재료연구원 금속분말연구실) | Young-Tae Kwon (Metal Powder Department, Korea Institute of Materials Science (KIMS)) Corresponding author