This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520oC. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515oC following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.

1. Introduction
2. Experimental
3. Results and Discussion
4. Conclusion
Acknowledgement

• 김희연(한양대학교 신소재공학과) | Heeyeon Kim (Department of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea)
• 박천웅(한양대학교 신소재공학과) | Chun Woong Park (Department of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea)
• 이원희(한양대학교 신소재공학과) | Won Hee Lee (Department of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea)
• 김영도(한양대학교 신소재공학과) | Young Do Kim (Department of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea) Corresponding Author