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Exploring Thermoelectric Transport Properties and Band Parameters of n-Type Bi2-xSbxTe3 Compounds Using the Single Parabolic Band Model KCI 등재

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  • URLhttps://db.koreascholar.com/Article/Detail/436366
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한국분말야금학회지 (Journal of Korean Powder Metallurgy Institute)
한국분말재료학회(구 한국분말야금학회) (Korean Powder Metallurgy Institute)
초록

The n-type Bi2-xSbxTe3 compounds have been of great interest due to its potential to achieve a high thermoelectric performance, comparable to that of p-type Bi2-xSbxTe3. However, a comprehensive understanding on the thermoelectric properties remains lacking. Here, we investigate the thermoelectric transport properties and band characteristics of n-type Bi2-xSbxTe3 (x = 0.1 – 1.1) based on experimental and theoretical considerations. We find that the higher power factor at lower Sb content results from the optimized balance between the density of state effective mass and nondegenerate mobility. Additionally, a higher carrier concentration at lower x suppresses bipolar conduction, thereby reducing thermal conductivity at elevated temperatures. Consequently, the highest zT of ~ 0.5 is observed at 450 K for x = 0.1 and, according to the single parabolic band model, it could be further improved by ~70 % through carrier concentration tuning.

목차
1. Introduction
2. Experimental Procedure
3. Results and Discussion
4. Conclusion
Acknowledgments
References
저자
  • Linh Ba Vu(Department of 3D Printing Materials, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea, Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu 41566, Republic of Korea)
  • Soo-ho Jung(Department of 3D Printing Materials, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea)
  • Jinhee Bae(Department of 3D Printing Materials, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea)
  • Jong Min Park(Department of 3D Printing Materials, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea)
  • Kyung Tae Kim(Department of 3D Printing Materials, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea)
  • Injoon Son(Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu 41566, Republic of Korea)
  • Seungki Jo(Department of 3D Printing Materials, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea) Corresponding author