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Design of Conductive Inks Containing Carbon Black and Silver Nanowires for Patternable Screen-Printing on Fabrics KCI 등재

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  • URLhttps://db.koreascholar.com/Article/Detail/439435
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한국분말야금학회지 (Journal of Korean Powder Metallurgy Institute)
한국분말재료학회(구 한국분말야금학회) (Korean Powder Metallurgy Institute)
초록

This study developed conductive inks composed of carbon black (CB) and silver nanowires (Ag NWs) for cost-effective screen-printing on fabrics. The Ag NW density within the CB matrix was precisely controlled, achieving tunable electrical conductivity with minimal Ag NW usage. The resulting inks were successfully patterned into shapes such as square grids and circles on textile surfaces, demonstrating excellent conductivity and fidelity. Adding 19.9 wt% Ag NWs reduced sheet resistance by ~92% compared to CB-only inks, highlighting the effectiveness and potential of this hybrid approach for cost-effective, high-performance textile-based electronics. The one-dimensional morphology of Ag NWs facilitated the formation of conductive percolation networks, creating efficient electron pathways within the CB matrix even at low loadings. This work advances the field of CB-based conductive inks and provides a scalable and practical method for producing functional, patterned electronic textiles.

목차
1. Introduction 
2. Experimental Section 
    2.1. Materials 
    2.2. Preparation of Carbon Black-Based Ink 
    2.3. Synthesis of Ag Nanowires 
    2.4. Preparation of Inks with Carbon Black and Ag Nanowires 
    2.5. Screen Printing of Conductive Inks on Fabrics 
    2.6. Characterization 
3. Results and Discussion 
4. Conclusion 
Funding
Conflict of Interest 
Author Information and Contribution 
Acknowledgement
References
저자
  • Seokhwan Kim(Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu, 41566, Republic of Korea, Innovative Semiconductor Education and Research Center for Future Mobility, Kyungpook National University, Daegu, 41566, Republic of Korea, Research Institute of Automotive Parts and Materials, Kyungpook National University, Daegu, 41566, Republic of Korea)
  • Geumseong Lee(Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu, 41566, Republic of Korea, Innovative Semiconductor Education and Research Center for Future Mobility, Kyungpook National University, Daegu, 41566, Republic of Korea, Research Institute of Automotive Parts and Materials, Kyungpook National University, Daegu, 41566, Republic of Korea)
  • Ki-Il Park(Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu, 41566, Republic of Korea, Innovative Semiconductor Education and Research Center for Future Mobility, Kyungpook National University, Daegu, 41566, Republic of Korea, Research Institute of Automotive Parts and Materials, Kyungpook National University, Daegu, 41566, Republic of Korea)
  • Yuho Min(Department of Materials Science and Metallurgical Engineering, Kyungpook National University, Daegu, 41566, Republic of Korea, Innovative Semiconductor Education and Research Center for Future Mobility, Kyungpook National University, Daegu, 41566, Republic of Korea, Research Institute of Automotive Parts and Materials, Kyungpook National University, Daegu, 41566, Republic of Korea) Corresponding author
  • Jinwoo Park(Defense Materials & Energy Technology Center Team 1, Agency for Defense Development, Daejeon, 34186, Republic of Korea)
  • Dahye Shin(Defense Materials & Energy Technology Center Team 1, Agency for Defense Development, Daejeon, 34186, Republic of Korea)
  • Kyoung Jin Jung(Defense Materials & Energy Technology Center Team 1, Agency for Defense Development, Daejeon, 34186, Republic of Korea) Corresponding author