The FOPLP method, which uses a square metal carrier to arrange semiconductor chips, offers significantly superior productivity and efficiency compared to conventional processes. However, metal carriers are prone to warping, dents and scratches due to thermal deformation, making surface inspection and correction work essential. Therefore, this study designed and fabricated a gantry guide capable of mounting an indicator and a vision module to effectively inspect the metal carrier surface and improve quality, then evaluated its performance. In the experiment, the gantry system’s performance was verified by evaluating its repeatability precision, and the vision module ensured data reliability through precision at four different magnifications.

Abstract
1. 서 론
2. 측정 장치의 설계 및 개발
3. 실험 결과 및 고찰
    3.1 갠트리 가이드의 정밀도
    3.2 비전 시스템 신뢰성 시험
4. 결 론
후 기
References

• 신준(Gangneung-wonju National University, Mechanical Engineering) | Joon Shin Corresponding author
• 최낙구(Hurust Co., Ltd) | Nakgoo Choi