Ethylene Tetrafluoroethylene (ETFE) has been widely used in long-span buildings because of its light weight and high transparency. This paper studies the short and long term creep behaviour of ETFE foil. A series of short-term creep and recovery tests were performed, in which the residual strain was observed. A long-term creep test of the ETFE foil was also performed over 110 days. A viscoelastic-plastic model was then established to describe the short-term creep and recovery behaviour. The model contains a traditional multi-Kelvin part and an added steady-flow component to represent the viscoelastic and viscoplastic behaviour, respectively. The model successfully fit the data for three stresses and six temperatures. Additionally, time-temperature equivalency was adopted to predict the long-term creep behaviour of ETFE foil. Horizontal shifting factors were determined from the process of shifting creep-curves at six temperatures. The long-term creep behaviours at three temperatures were predicted. Finally, the long-term creep test showed that the short-term creep test at identical temperatures insufficiently predicted additional creep behaviour, and the long-term test verified the horizontal shifting factors derived from the time-temperature equivalency.

탄성 반도체 칩과 점탄성 접착제층의 계면에 존재하는 모서리 균열에 대한 응력확대계수를 조사하였다. 이러한 균열들은 자유 경계면 부근에 존재하는 응력 특이성으로 인해 발생할 수 있다. 계면 응력상태를 해석하기 위해서 시간 영역 경계요소법이 사용되었다. 작은 크기의 모서리 균열에 대한 응력확대계수가 계산되었다. 점탄성 이완으로 인해 응력확대계수의 크기는 시간이 경과함에 따라 작아진다.