Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

This study for preparation of aluminum nitride (AlN) with high purity was carried out by self-propagating high-temperature synthesis method in two different systems, Al-N and Al-N-AlN, with the change of nitrogen gas pressure and dilution factor. On the occasion of Al-N system, unreacted aluminum was detected in the product in spite of high nitrogen pressure, 10 MPa, This may be caused by obstructing nitrogen gas flow to inner part of molten and agglomerate of aluminum, formed in pre-heating zone. In Al-N-AlN system, AlN with a purity of 95% or ever can be prepared in the condition of f 0.5, PN2 1 MPa, and the purity can be elevated to 98% over in the condition of f = 0.7 and PN2 = 10 MPa