In this paper, the features of fatigue crack growth under ModeⅠ loading are studied. Double cantilever beam specimens were used. The effects of adherend thickness, rubber modification and adhesive thickness on fatigue crack growth were examined. The experimental results show that some of these parameters do apparently affect fatigue crack growth. Resistance to ModeⅠ fatigue crack growth are increased by rubber modification. The effects of adhesive thickness and rubber content on fatigue crack growth were explained by von Mises's equivalent stress using BEM analysis.

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

본 연구에서는 강재가 맞대기 이음으로 연결될 경우 CFRP(Carbon Fiber Reinforced Plastic) 쉬트(sheet)를 맞대기 이 음부에 접착할 경우 강재 및 CFRP 쉬트에 발생하는 응력을 해석하였다. CFRP 쉬트로 보강한 경우 접착제의 두께, 강재와의 접착 길이, CFRP 강도 변화를 매개변수로 사용하여 이 매개변수에 변화에 따른 이음부의 응력분포를 분 석하였다. 또한 CFRP를 여러 층으로 접착할 경우 각 층의 강도를 다르게 변화시켜 맞대기 이음부에 유리한 응력분 포를 나타내는 CFRP의 강도를 제시하였다. 본 연구를 위해 빠른 수렴성을 가지며 왜곡된 요소형상에서도 정확한 응력결과를 보이는 강화변형률장(Enhanced Assumed Strain Field)을 사용한 평면변형률 유한요소에 대한 프로그램을 작성하였다.

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

Polyurethane adhesive is used in various fields as flexible packaging materials including a food packaging field. Therefore, the purpose of this study is synthesis of polyurethane adhesive which uses aliphatic isocyanate, and compares with aromatic isocyanate. The isocyanates for this test are toluene-2,4-diisocyanate(TDI), hexamethylene diisocyanate(HDI), 4,4-dicyclohexyl ethane diisocyanate(H12MDI), and isophorone diisocyanate(IPDI). And, the effect of any other diisocyanate are evaluated by several methods as for curing rate test, accelerate weathering test, and peel strength test. The polyurethane adhesive using curing catalyst and HDI has adhesion strength of about 560 g/15 mm between aluminium foil and nylon, about 1,520 g/15 mm between nylon and CPP. Those parameters are similar to polyurethane adhesive with TDI. Also, in case of curing rate, those are similar to TDI type polyurethane adhesive. Moreover, data of δE as color variation by QUV tester is equal to 4.12, as 48% against those of TDI type.

The crack initiation equals to fracture for bonded joint with brittle adhesive. The criterion is formulated in terms of the quasi-stress intensity factor Kp, for the maximum principle stress, that is analogous to the stress intensity factor used to characterize the stress field in the vicinity of bond terminus. Kp is evaluated using a boundary element analysis. The crack initiation at the terminus of adhesive bonded joints is estimated with the critical quasi-stress intensity factor Kp. This method presented here hardly pays attention to the crack propagation. Since there is a large influence of crack propagation on the strength of adhesive joints and structures, crack propagation must be taken into account on strength prediction of bonded joints. The quasi-stress intensity factor Kp for the maximum principle stress can use as the criteria of the crack initiation at the terminus of adhesive bonded joints having various shapes.

The objectives of the present study are to show how to predict the crack initiation at the terminus of adhesive bonded joints to calculate the crack growth in the adhesive layer using the total strain energy release rate. The crack propagation for ductile adhesives is theoretically estimated using -curve. -curve is determined from static shearing tests of single lap joints. The total strain energy release rate for single lap joints is evaluated using a boundary element analysis. The strength prediction is conducted by means of the R-curve and the total strain energy release rate.The conclusions are summarized as follows; (1) A crack propagation geometry of the bonded structure using ductile adhesive was predicted from the distribution of the total strain energy release rate. (2) The final failure load for lap joints is predicted by the R-curve method based on the fracture mechanics. (3) The final failure load for stiffened plates with a steel L-beam is predicted by the R-curve method based on the fracture mechanics.

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.

저용융점을 가진 새로운 무기접착제인 단사정 HBO2가 알루미나 분말의 선택적 레이저 소결을 하기 위한 접착제로서 개발되었다. 120˚C로 유지된 진공오븐 안에서 Boron Oxide 분말을 탄수시키면 단사정 HBO2가 만들어진다. 이것을 이용하여 만들어진 green body는 현재까지 알루미나 분말의 선택적 레이저 소결을 위하여 개발된 다른 무기 접착제들인 알루미늄(AI)과 Ammonium Phosphate(NH4H2PO4)을 이용하여 제조된 것에 비교하여 훨씬 높은 굽힘 강도를 가지고 있고 또 정밀도가 우수하였다. Green body를 열처리하여서 얻은 세라믹 시편도 똑같은 결과를 보여주었다. 이 이유는 단사정 HBO2가 낮은 점도를 보여주고 알루미나 분말에 대하여 좋은 젖음성을 가지고 있기 때문에 가능한 것으로 사료되어진다. 접착제로서 Boron Oxide의 양, 레이저 에너지밀도 등이 SLS에 의하여 제조되어진 복합재료의 굽힘강도에 미치는 영향이 조사되었다.

저용융점을 가진 새로운 무기 접착제인 단사정 HBO2가 알루미나 분말의 선택적 레이저 소결을 하기 위한 접착제로서 개발되었다. 이것을 이용하여 만들어진 green body는 현재까지 알루미나 분말의 선택적 레이저 소결을 위하여 개발된 다른 무기 접착제들인 알루미늄(Ai)과 Ammonium Phosphate(NH4H2PO4)을 이용하여 제조된 것에 비교하여 훨씬 높은 굽힘 강도를 가지고 있고 또 정밀도가 우수하였다. Green Body는 후속의 열처리를 받음으로써 저밀도 단상 세라믹 AI18B4O33과 다상 세라믹 복합재료 AI2O3-AI4B2O9으로 된다. AI18B4O33과 AI4B2O9의 결정립의 모양은 휘스커 구조와 유사하였다. 재료인자와 가공변수가 이 세라믹의 기계적 및 물리적 성질에 미치는 영향이 조사되었다.

In this study, the bond strength of FRP reinforced inorganic adhesive developed in previous studies was exposed to high temperature. As a result of the experiment, it was confirmed that the bond strength was increased at room temperature in the range of 100 to 200 ° C, but the width gradually decreased with increasing temperature.

The highest latent calorific value and total calorific value of MPCM and aqueous adhesive mixed samples were 44℃, followed by 50℃, 28℃ and 31℃. At 44℃, it is considered to be the most suitable for applying it as a component of the adhesive of the decorative wood floor plate because it is higher than the MPCM combination of other melting points. The remaining samples except for 44℃ showed an increase in latent heat and total calorific value when MPCM was added to the aqueous adhesive. The higher the amount of MPCM, the higher the viscosity effect

The purpose of this study is to assess the strengthening effect of fiber-reinforced polymer(FRP) grids on flexural members. For this purpose, experimental study was conducted using seven flexural specimens with the main variables of an FRP grid and inorganic mortar used as adhesive. All the specimens failed due to the tensile rupture of FRP grids without debonding between FRP grids and inorganic mortar. It was found that the strengthening effect was dependent on the material properties of FRP grids.