In this study, the crack initiation and propagation behavior of interfacial crack in bimaterial are discussed. Normal crack opening displacements(NCOD) and stresses are analyzed by finite element method using ANSYS and used for extracting fracture parameters. The energy release rates can not explained the initiation and crack propagation velocity of interfacial crack. Initial velocity of crack propagation is dependent upon the normal and shear stress behind of crack tip. The crack propagation velocity of interfacial crack is very dependent upon the normal and shear stress behind of crack tip. In case of negative shear displacements increase in interfacial crack, initiation delay of crack propagation is dependent upon the negative shear stress ahead of crack tip due to the suppressing of crack opening. In case of positive shear displacements increase in interfacial crack, initiation delay of crack propagation is dependent upon the stress behind of crack tip due to the stress decrease. The fracture toughness increase is due to the initiation delay of crack propagation.

Abstract
 1. 서론
 2. 매개변수(Parameter)
 3. 해석 모델
 4. 해석 조건과 결과
  4.1 계면균열의 거동
  4.2 에너지 해방률의 변화
  4.3 균열 면의 응력 분포
  4.4 균열선단에서의 응력
 5. 결론
 참고문헌

• 최병선(대구가톨릭대학교 기계자동차공학부) | Byung-Sun Choi