Theoretical modeling is presented for the prediction of prestress loss of strands during the steam curing process. The model comprises heat transfer model, bond-slip model at elevated temperature and micromechanical model for prestress loss. The model was able to predict the experimentally measured prestress loss in a reasonable accuracy.

• 이차돈(중앙대학교 건축공학과 교수, 공학박사) | Lee, Chadon
• 고민혁(중앙대학교 건축공학과, 석사) | Ko, Minhyunk
• 허서영(중앙대학교 건축공학과, 석사) | Heo, Seoyoung