The expansion of the display market could mass-produce the product which becomes the super-slim and ultra-lighting according to the demand of customer. This change etched the mobile display panel in order to make the thin glass. The wet etching refers to the process of removing selectively the unnecessary part in order to form the circuit pattern among the semi-conductor or the LCD manufacturing process. The wet etching can progress the etching about a large amount at a time but the thickness of glass is not smooth or not etched according to the process condition. In this study, the defect factor in the etching process tries to be analyze. The experimental design was established and the processing condition was optimized in order to minimize under non-etch part generation by the experiment of design.

1. 서 론
 2. 습식 식각 및 공정파라미터
  2.1 글라스 면취
  2.2 식각률(Etching rate)
  2.3 유량
 3. 실험 및 고찰
  3.1 다구치 방법
  3.2 실험 결과 및 분석
  3.3 회귀분석
 4. 결 론
 후 기
 References

• 유승기(Member, Kongju National University) | Seung- gi Yu
• 김재경(Kongju National University graduate school Department of mechanical engineering) | Jae-kyung K im
• 전의식(Member, Kongju National University) | Euy- sik Jeon Corresponding author