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확산 접합에 의해 제조된 텅스텐-레늄 합금/티타늄/그래파이트 접합체의 미세구조 및 고온 안정성 KCI 등재 SCOPUS

Interfacial Microstructure of Diffusion-Bonded W-25Re/Ti/Graphite Joint and Its High-Temperature Stability

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  • URLhttps://db.koreascholar.com/Article/Detail/320604
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한국재료학회지 (Korean Journal of Materials Research)
한국재료학회 (Materials Research Society Of Korea)
초록

Graphite was diffusion-bonded by hot-pressing to W-25Re alloy using a Ti interlayer. For the joining, a uniaxial pressure of 25 MPa was applied at 1600 oC for 2 hrs in an argon atmosphere with a heating rate of 10 oC min−1. The interfacial microstructure and elemental distribution of the W-25Re/Ti/Graphite joints were analyzed by scanning electron microscopy (SEM). Hot-pressed joints appeared to form a stable interlayer without any micro-cracking, pores, or defects. To investigate the high-temperature stability of the W-25Re/Ti/Graphite joint, an oxy-acetylene torch test was conducted for 30 seconds with oxygen and acetylene at a 1.3:1 ratio. Cross-sectional analysis of the joint was performed to compare the thickness of the oxide layer and its chemical composition. The thickness of W-25Re changed from 250 to 20 μm. In the elemental analysis, a high fraction of rhenium was detected at the surface oxidation layer of W-25Re, while the W-25Re matrix was found to maintain the initial weight ratio. Tungsten was first reacted with oxygen at a torch temperature over 2500 oC to form a tungsten oxide layer on the surface of W-25Re. Then, the remaining rhenium was subsequently reacted with oxygen to form rhenium oxide. The interfacial microstructure of the Ti-containing interlayer was stable after the torch test at a temperature over 2500 oC.

저자
  • 김주형(한국과학기술원) | Joo-Hyung Kim
  • 백창연(한국과학기술원) | Chang Yeon Baek
  • 김동석(한국원자력연구원) | Dong Seok Kim
  • 임성택(국방과학연구소) | Seong Taek Lim
  • 김도경(한국과학기술원) | Do Kyung Kim Corresponding author