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타이어 몰드 표면에서의 열유속 및 열전달 시간에 따른 몰드의 온도분포에 관한 수치해석 연구 KCI 등재

A Numerical Study on the Temperature Distribution of Mold according to the Heat Flux and Heat Transfer Time at the Surface of Tire Mold

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한국기계기술학회지 (Journal of the Korean Society of Mechanical Technology)
한국기계기술학회 (Korean Society of Mechanical Technology)
초록

In this study, we designed the 3-dimensional tire mold according to the A automobile company’s tire model, and analysed the distribution of temperature of mold using the numerical method when the heat flux and heat transfer time at the surface of tire mold were changed. A analysis region of mold was the 1/16 of entire mold, and the grid number was about more than 880 thousand. In order to analyze the temperature change of mold, the thinnest part of the mold was chosen as the research object, and then the temperature of 6 points on the vertical downward direction of the thinnest part was analyzed with the time change. While the numerical condition was that heat flux was 321,200 W/m2, 440,000 W/m2 and 880,000 W/m2, and measuring time was 0.1 second, 0.2 second, 0.5 second and 1 second, respectively. As a result, the temperature difference between the surface temperature and the lowest temperature of mold was 7.3℃ when the heat transfer time was 0.1 second. Also, the minimum temperature difference was almost 0.11℃ when the heat transfer increased to 1 second. It can be explained that the main material of tire mold was aluminum and its thermal conductivity was high (k=140 W/m·K). In addition, when the heat transfer time was more than 1 second, the heat flux of mold surface will be transmitted at the inside of the thinnest part, and the heat transfer will be a marked difference according to the shape of the thinnest part.

저자
  • 고동국(Division of Mechanical Design Engineering, Chonbuk National University) | Dong-Guk Ko
  • 갈준총(Division of Mechanical Design Engineering, Chonbuk National University) | Jun-Cong Ge
  • 김민수(Division of Mechanical Design Engineering, Chonbuk National University) | Min-Soo Kim Corresponding Author