Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 임찬규(부경대학교 인쇄공학과) | Chan-Kyu Lim (Pukyong National University)
• 권보석(부경대학교 인쇄공학과) | Bo-Suk Gyun (Pukyong National University)
• 남수용(부경대학교 인쇄공학과) | Su-Yong Nam (Pukyong National University) Corresponding author
• 손민정(한국기계연구원) | Min-Jung Son (Korea Institute of Machinery and Materials)
• 김인영(한국기계연구원) | Inyoung Kim (Korea Institute of Machinery and Materials)
• 양상선(한국기계연구원 부설 재료연구소 분말/세라믹 연구본부) | Sangsun Yang (Korea Institute of Materials Science)