In order to secure competitiveness of companies in the semiconductor industry, state management of equipment is one of the most important key factors. Particularly, after carrying out preventive maintenance (PM) work to maintain the best equipment condition, process reliability inspection is carried out. This work must be performed manually by the intervention of the operator. This inspection work is becoming more and more difficult due to the difficulty of the manufacturing worker, the increase of the simple repetitive workload, and the increase of the inspection items for the engineer, as the condition and the procedure continuously change as the semiconductor scaling down. Therefore, we would like to carry out an empirical study on the construction of an automatic inspection system in order to carry out the more reliable and efficient inspection procedure by eliminating the problems and unreasonableness of the past based on the investigation and analysis of the work procedures and conditions of the existing manual method.