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A study on Change of Failure rate for CCA by Reliability Analysis Methods and Operation Environment condition

신뢰도 분석 방법 및 운용환경 조건에 따른 회로카드조립체 고장율 변화

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  • URLhttps://db.koreascholar.com/Article/Detail/353409
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한국산업경영시스템학회 (Society of Korea Industrial and Systems Engineering)
초록

When weapon system is designed and developed, a reliability is one of important factors to determine the development goal. The reliability analysis of the weapon system and equipment is based on MIL Specification, MIL-HDBK-217F and MIL-HDBK-338B. And the weapon system is operated on various environments by operating concept of the military using the weapon system. This study, at first, present failure rate by PSA comparing with failure rates by PCM, the different reliability analysis method, for same CCA(Circuit Card Assembly). And the study present change of reliability analysis results for CCA on various operation environment condition..

목차
1. 서론
 2. 신뢰도 분석 방법에 따른 고장율 비교
  2.1 신뢰도 분석 대상 및 분석 조건 설정
  2.2 부품수량분석 결과
  2.3 부품부하분석 결과
  2.4 고장율 비교
 3. 운용환경 조건에 따른 고장율 비교
  3.1 신뢰도 분석 대상 및 분석 조건 설정
  3.2 MIL-HDBK-217F에 따른 분석 결과
  3.3 MIL-HDBK-338B에 따른 분석 결과
  3.4 고장율 비교
 4. 결론
 참고문헌
저자
  • 이승률(LIG넥스원㈜ ILS연구센터)
  • 박경덕(LIG넥스원㈜ ILS연구센터)
  • 전동주(LIG넥스원㈜ ILS연구센터)
  • 이수중(LIG넥스원㈜ ILS연구센터)