In this study, the bond strength of FRP reinforced inorganic adhesive developed in previous studies was exposed to high temperature. As a result of the experiment, it was confirmed that the bond strength was increased at room temperature in the range of 100 to 200 ° C, but the width gradually decreased with increasing temperature.

Abstract
 1. 서 론
 2. 실험계획 및 방법
  2.1 실험계획
  2.2 실험방법
 3. 실험결과 및 고찰
 4. 결 론
 참고문헌

• 조현서(한국교통대학교 건축공학과) | Cho Hyun Seo
• 지우람(한국교통대학교 건축공학과) | Ji Woo Ram
• 이건철(한국교통대학교 건축공학과) | Lee Gun Cheol