Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of Cu2SO4 and H2SO4 at a current density of 10 mA/cm2. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about 80 μm. The contact resistance of the copper electrode is 0.89 mΩ·cm2, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are 1 Ω/□ and 40 Ω/□, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

Abstracts
 1. 서론 및 이론
 2. 실험 방법
 3. 결과 및 고찰
  3.1 전극 패턴 형성
  3.2 구리 전해도금
  3.3 전극 형성 후 접촉 비저항 측정
 4. 결 론
 References

• 김경민(충남대학교 에너지기술과학대학원) | Gyeong Min Kim (Graduate School of Energy Science and Technology, Chungnam National University)
• 조영준(충남대학교 에너지기술과학대학원) | Young Joon Cho (Graduate School of Energy Science and Technology, Chungnam National University)
• 장효식(충남대학교 에너지기술과학대학원) | Hyo Sik Chang (Graduate School of Energy Science and Technology, Chungnam National University) Corresponding author