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3축 전자동 Wafer & LCD 균일 분포도 표면측정 System 개발(1차)

The Development of Uniform Distribution Surface Measurement System in Three Axis Full Automatic Wafer and LCD(The First)

이정익
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한국기계기술학회 학술대회논문집 (Proceedings of KSMT Annual Meeting)
한국기계항공기술학회(구 한국기계기술학회) (Korean Society of Mechanical Technology)
초록

This study is a development of a system for measuring the surface resistance of wafer and LCD by utilizing a three-axis positioner. Previous wafer measuring system is a developed product for measuring a wafer surface resistance. This is developed very long time. This is not a real action that it is needed a persistence development.. So, that is effected as weak point by simple mechanism and old software. This product is forecasted not being risen in world market. Therefore, this new product(surface measuring system by three axis positioner type) through this research is off the point a previous one axis revolute type, this new product is forecasted capable of a measurement not only wafer but also LCD.

키워드
Visual시각의POPPoint of product:생산공정관리DPDDigital Picking Display:작업지시영상투영시스템DPSDigital Picking System:제조물 표기 시스템
목차
Abstract
 1. 서론
 2. 표면측정 System 개발 현황
 3. 연구 목표
 4. 표면측정 System 개발 내용 및 방법
 5. 개발 시 기대 및 예상효과
 6. 개발 목표
 References
저자
  • 이정익(인하공업전문대학. 기계설계과) | Jeongick Lee