Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10−6/℃) than did the monolithic synthesized Cu sintered body.

Abstract
1. 서 론
2. 실험 방법
    2.1 나노 Cu-Zn 분말 제조 및 소결
    2.2 특성분석
3. 결과 및 고찰
4. 결 론
References

• 오복현(국립목포대학교 신소재공학과) | Bok-Hyun Oh (Department of Advanced Materials Science and Engineering, Mokpo National University)
• 마충일(국립목포대학교 신소재공학과) | Chung-Il Ma (Department of Advanced Materials Science and Engineering, Mokpo National University)
• 이상진(국립목포대학교 신소재공학과, 국립목포대학교 세라믹산업기술연구소) | Sang-Jin Lee (Department of Advanced Materials Science and Engineering, Mokpo National University, Research Institute of Ceramic Industry and Technology, Mokpo National University) Corresponding author