The theoretical capacity of silicon-based anode materials is more than 10 times higher than the capacity of graphite, so silicon can be used as an alternative to graphite anode materials. However, silicon has a much higher contraction and expansion rate due to lithiation of the anode material during the charge and discharge processes, compared to graphite anode materials, resulting in the pulverization of silicon particles during repeated charge and discharge. To compensate for the above issues, there is a growing interest in SiOx materials with a silica or carbon coating to minimize the expansion of the silicon. In this study, spherical silica (SiO2) was synthesized using TEOS as a starting material for the fabrication of such SiOx through heating in a reduction atmosphere. SiOx powder was produced by adding PVA as a carbon source and inducing the reduction of silica by the carbothermal reduction method. The ratio of TEOS to distilled water, the stirring time, and the amount of PVA added were adjusted to induce size and morphology, resulting in uniform nanosized spherical silica particles. For the reduction of the spherical monodisperse silica particles, a nitrogen gas atmosphere mixed with 5 % hydrogen was applied, and oxygen atoms in the silica were selectively removed by the carbothermal reduction method. The produced SiOx powder was characterized by FE-SEM to examine the morphology and size changes of the particles, and XPS and FT-IR were used to examine the x value (O/Si ratio) of the synthesized SiOx.

Infrared radiation (IR) refers to the region of the electromagnetic radiation spectrum where wavelengths range from about 700 nm to 1 mm. Any object with a temperature above absolute zero (0 K) radiates in the infrared region, and a material that transmits radiant energy in the range of 0.74 to 1.4 um is referred to as a near-infrared optical material. Germanatebased glass is attracting attention as a glass material for infrared optical lenses because of its simple manufacturing process. With the recent development of the glass molding press (GMP) process, thermal imaging cameras using oxide-based infrared lenses can be easily mass-produced, expanding their uses. To improve the mechanical and optical properties of commercial materials consisting of ternary systems, germanate-based heavy metal oxide glasses were prepared using a melt-cooling method. The fabricated samples were evaluated for thermal, structural, and optical properties using DSC, XRD, and XRF, respectively. To derive a composition with high glass stability for lens applications, ZnO and Sb2O3 were substituted at 0, 1, 2, 3, and 4 mol%. The glass with 1 mol% added Sb2O3 was confirmed to have the optimal conditions, with an optical transmittance of 80 % or more, a glass transition temperature of 660 °C, a refractive index of 1.810, and a Vickers hardness of 558. The possibility of its application as an alternative infrared lens material to existing commercial materials capable of GMP processing was confirmed.

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10−6/℃) than did the monolithic synthesized Cu sintered body.