본 연구에 세는 제빵용 소맥분의 손상전분 함량을 비교 분석하여 최적의 작업조건 설정과 제빵 품질을 향상시킬 목적으로 손상전분 함량을 각각 달리하여 반죽의 물리적 특성 및 제빵 적성을 검토하였다. DNS와 CWRS 및 SW 등의 소맥을 제분하여 손상전분 함량 6.5%, 8.2%, 9.0%, 9.5% 및 10.5%를 함유한 시료로 제조한 반죽의 물리적 및 이화학적 특성인 farinogram, extensogram, amylogram 등을 조사하였으며

The purpose of this research is the establishment of optimal processing and the quality improvement of confectionary analysis of the damaged starch content of flour. I studied the rheological and bread making properties of the dough containing different damaged starch content. I examined rheological and physico- chemical characteristic farinograph, extensograph and amylograph with DNS, CWRS and SW containing 6.5%, 8.2%, 9.0%, 9.0% and 10.5% of damaged starch. And I measured the hardness and specific volume and performed the functional survey by rheometer for quality control. In the amylogram, at the damaged starch content 9.5% at such the maximum viscosity was 900 B.U. the volume of bread fermention tolerance were increased. In addition, the extensegram after 135 min showed that maximum resistance of the dough were 570 B.U at the damaged starch contents of 9.5% and the bread had homogeneous air cells and internal structures at the damaged starch contents of 9.5% at which the area(A), resistance(R) and R/E value of the dough were highest.

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