논문 상세보기
pp.303-308
The semiconductor and display industries require the development of plasma resistant materials for use in high density plasma etching process equipment. Yttria (Y2O3) is a ceramic material mainly used to ensure good plasma resistance properties, which requires a dense microstructure. In commercial production, a sintering process is applied to reduce the sintering temperature of Y2O3. In this study, the effect of the addition of glass frit to the sintered specimen was examined when manufacturing yttria sintered specimens for semiconductor process equipment parts. The Y2O3 specimen was shaped into a Ø50 mm size and then sintered at 1,600 °C for 1~8 h. The characteristics, X-ray diffraction pattern, densities, contraction rate of the specimen, and swelling of the surface of the Y2O3 specimens were investigated as a function of the sintering time and glass frit addition. The Y2O3 specimen exhibited a density of over 4.9 g/cm3 as the sintering time increased, and the swelling phenomenon characteristics were improved by glass frit, by controlling particle size.
2. 실험 방법
2.1. 이트리아소결체 제작
2.2. 글라스프릿 제작
3. 결과 및 고찰
3.1. 이트리아 분말의 특성
3.2. 이트리아 2종 분말을 이용한 소결체 제조
3.3. 글라스프릿의 특성
3.4. 글라스프릿 포함한 소결체 특성
4. 결 론
Acknowledgement
References
<저자소개>
