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전환식 평판형 마그네트론 스퍼터링 방법으로 제작한 AlN박막의 c축 배향성 및 잔류응력에 대한 X선 회절법을 이용한 측정 KCI 등재 SCOPUS

Measurement of c-axis Orientation and Residual Stress of AlN Thin Film Produced by Switching-type Planar Mag netron S puttering M ethod using X-ray D iffraction M ethod

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한국재료학회지 (Korean Journal of Materials Research)
한국재료학회 (Materials Research Society Of Korea)
초록

AlN thin film is highly valued for use as a high-temperature material because of its excellent heat resistance, thermal conductivity and high mechanical strength. In addition, it is known as a replacement material for ZnO, because it can be applied to surface acoustic wave elements and high-frequency filters using piezoelectric properties or sound velocity. In this study, an alternating sputtering method was used to fabricate an AlN thin film with excellent film quality. The c-axis orientation and residual stress of the fabricated AlN thin film were measured using an X-ray diffraction method. Nitrogen gas pressure and target electrode conversion time are important deposition conditions when producing a thin film using the alternating sputtering method. The AlN thin film fabricated on the glass substrate using the alternating planar magnetron sputtering method exhibited a crystal structure in which the c-axis was preferentially oriented in the normal direction of the substrate surface. The c-axis orientation was better when the target electrode switching time was short under the condition of low nitrogen gas pressure. Residual stress is tensile stress in the very low nitrogen gas pressure range (PN ≤ 0.3 Pa), compressive stress in the low nitrogen gas pressure range (0.3 < PN < 0.9 Pa), and in the high nitrogen gas pressure range (PN ≥ 0.9 Pa), it becomes tensile stress. Residual stress shows tensile stress when the switching time is short, tensile stress decreases as the switching time increases, and becomes compressive stress when the switching time is sufficiently long (300 to 600 s). Compared to the simultaneous sputtering of two targets, the use of the alternating sputtering method can produce a high-quality thin film with excellent c-axis orientation and low residual stress.

목차
Abstract
1. 서 론
2. 이 론
    2.1. c축 배향막의 X선 응력해석 방법
3. 실험 방법
    3.1. AlN박막의 제작
    3.2. X선을 이용한 격자 변형률 측정 및 조건
4. 결 과
    4.1. AlN 박막의 구조
    4.2. c축 배향성 및 00・2 회절선 강도
    4.3. 격자 변형률 측정(sin선도)
    4.4. AlN 박막의 잔류응력
5. 고 찰
    5.1. 질소가스 압력 의존성
    5.2. 타깃 전극 전환시간 의존성
6. 결 론
Acknowledgement
References
<저자소개>
저자
  • 한창석(호서대학교 자동차ICT공학과) | Chang-Suk Han (Department of ICT Automotive Engineering, Hoseo University, Dangjin 31702, Republic of Korea) Corresponding author
  • 김태섭(호서대학교 자동차ICT공학과) | Tae-Seop Kim (Department of ICT Automotive Engineering, Hoseo University, Dangjin 31702, Republic of Korea)
  • 고영욱(호서대학교 자동차ICT공학과) | Young-Wook Ko (Department of ICT Automotive Engineering, Hoseo University, Dangjin 31702, Republic of Korea)