A Study on the Stress Concentration Factors according to Changes in Internal Grid and Pinhole of a Flat Plate under Bending Load
When manufacturing a square plate with a pinhole, the following conclusions were obtained as a result of analyzing the effect of changes in the size of the grid filling the inside of the plate and the presence or absence of a pinhole on the stress concentration factors. 1. It can be seen that in the case where there is a pinhole, the overall stress concentration factors is twice as high as in the case where there is no pinhole. In addition, in the case where there is no pinhole, it can be seen that the stress concentration factors fluctuates at a certain standard depending on the position of the pinhole and the internal grid, and in the case where there is a pinhole, it decreases at a certain point and then increases again. 2. In the case where there is no pinhole, when the L/H ratio increases from 0.1 to 0.3, the Kt value increases from 1.8 to 2.7, an increase rate of approximately 50%. Similarly, in the case of a pinhole, when the L/H ratio increases from 0.1 to 0.4, the Kt value increases from 2.0 to 3.0, an increase rate of about 50%.